Dev Malhotra
Independent Researcher
India
ABSTRACT
This manuscript presents an experimental investigation into heat transfer enhancement in microchannel heat sinks fabricated from oxygen-free high-conductivity copper. Fluid flow experiments were conducted with deionized water at Reynolds numbers ranging from 200 to 1200. Surface enhancements—namely, transverse ribs and dimpled walls—were evaluated for their effects on Nusselt number and pressure drop. Results demonstrate up to a 45 % increase in heat transfer coefficient compared to smooth microchannels, at the cost of a 20 % higher pumping power. Correlations for Nusselt number and friction factor as functions of Reynolds number and enhancement geometry are proposed. The study provides design guidelines for optimizing microchannel heat sink performance in electronics cooling applications prevalent up to 2015.
KEYWORDS
Microchannel heat sink; heat transfer enhancement; transverse ribs; dimpled walls; Reynolds number.
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